Welcome to WAIE 2021
Xian, China 中国西安丨 November 19-21, 2021
2021 3rd International Workshop on Artificial Intelligence and Education will take place in Xi'an, China (中国西安) during November 19-21, 2021, sponsored by Xidian University, China, hosted by School of Telecommunications Engineering, Xidian University, supported by Université de Montréal, Canada, Okayama University, Japan, etc.
2021年第三届人工智能与教育国际研讨会将于2021年11月19-21日在中国西安召开，本次会议由西安电子科技大学主办， 西安电子科技大学通信工程学院承办，也受到了加拿大蒙特利尔大学，日本冈山大学等学术单位以及机构的支持。会议定位为人工智能与教育应用技术及产业化发展交流探讨，面向智能技术企业和科研院所研发人员, 工程师, 市场开拓者和行业组织, 涉及内容为人工智能与教育发展趋势, 应用模式, 商业模式, 创业经验等. 该会议已于2019年在新加坡召开, 2020年因新冠疫情影响启用网络平台成功召开.
AI has already been applied to education primarily in some tools that help develop skills and testing systems. As AI educational solutions continue to mature, the hope is that AI can help fill needs gaps in learning and teaching and allow schools and teachers to do more than ever before. AI can drive efficiency, personalization and streamline admin tasks to allow teachers the time and freedom to provide understanding and adaptability—uniquely human capabilities where machines would struggle. By leveraging the best attributes of machines and teachers, the vision for AI in education is one where they work together for the best outcome for students. Since the students of today will need to work in a future where AI is the reality, it’s important that our educational institutions expose students to and use the technology.
All submissions will be blind reviewed by the Technical Committees on the basis of technical quality, relevance to conference topics of interest, originality, significance, and clarity. Accepted and selected papers will be recommended to be published in the WAIE Conference Proceedings Series, which could be submitted for Ei Compendex and Scopus Index.
期刊推荐: IJSSC Special Issue on Artificial Intelligence in Cyber-Physical Systems (请点击链接进入详细页面) (Please note: all accepted papers in IJSSC Special Issue could be presented in WAIE conference. 被期刊录用的文章，将被邀请在会议上作报告。)
MORE USEFUL INFORMATION
Sub. Deadline: July 15, 2021
Not. Acceptance: August 05, 2021
Reg. Deadline: August 20, 2021
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